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RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA, BHOPAL
PROGRAMME: ELECTRONICS AND COMMUNICATION
COURSE: EC-803 NANO-TECHNOLOGY
Introduction :The ‘Top down’ and ‘Bottom up’ approach, Why Nanoelectronics,Nanotechnology potential. COURSE: EC-803 NANO-TECHNOLOGY
Unit-I
Band structure and density of states at Nanoscale: energy bands, density of states at low dimensional structure.
Electrical transport in Nanostructure:Electrical conduction in metals, insulator/ionic crystals and semiconductors. Conduction mechanism in bulk, thin film and low dimensional system. Introductory quantum mechanics for
Nanoscience: size effect in smaller systems, quantum behavior of nanometric world.
Unit-II
Tunnel junction and application of tunneling: Tunneling through a potential barrier, potential energy profiles of material interfaces,applications of tunneling.
Quantum wells, wires and dots: Semiconductor hetrostructure and quantum wells, quantum dots and nanoparticles.
Unit-III
Single electron transistor: Coulomb Blockade, single electron transistor, other SET and FET structures.
Unit-IV
Ballastic and spin transport: Classical and semi-classical transport, ballistic transport, carbon nanotubes and nanowires, transport of spin and spintronics.
The era of new Nanostructures of carbon: Buck minsterfullerence, Nanodiomond, BN Nanotubes, Molecular Machine,Nanobiometrics.
Unit V
Fabrication technology: Top-down vs bottom-up technology.
Lithographic process: Lithography, Nanolithography, split gate technology, self assembly, limitation of lithographic process.
Non-lithographic techniques: Plasma arc discharge, sputtering, evaporation, chemical vapour deposition, pulsed laser deposition,molecular beam epitaxy, sol-gel technique, electrodeposition and other process.
References Books:
Unit-II
Tunnel junction and application of tunneling: Tunneling through a potential barrier, potential energy profiles of material interfaces,applications of tunneling.
Quantum wells, wires and dots: Semiconductor hetrostructure and quantum wells, quantum dots and nanoparticles.
Unit-III
Single electron transistor: Coulomb Blockade, single electron transistor, other SET and FET structures.
Unit-IV
Ballastic and spin transport: Classical and semi-classical transport, ballistic transport, carbon nanotubes and nanowires, transport of spin and spintronics.
The era of new Nanostructures of carbon: Buck minsterfullerence, Nanodiomond, BN Nanotubes, Molecular Machine,Nanobiometrics.
Unit V
Fabrication technology: Top-down vs bottom-up technology.
Lithographic process: Lithography, Nanolithography, split gate technology, self assembly, limitation of lithographic process.
Non-lithographic techniques: Plasma arc discharge, sputtering, evaporation, chemical vapour deposition, pulsed laser deposition,molecular beam epitaxy, sol-gel technique, electrodeposition and other process.
References Books:
1. G. W. Hanson: Fundamentals of Nanoelectronics, Pearson Education.
2. K. K. Chattopadhyay and A. N. Banerjee: Introduction to Nanoscience and Nanotechnology, PHI Learning.
3. Vlaadiniz U. Mitin: Introduction to Nanoelectronics, Cambridge University Press.
4. M. Dragman and D. Dragman: Nanoelectronics- Principles and devices, Artech House.
5. Karl Goser: Nanoelectronics and Nanosystems, Springer.
6. Daniel Minoli: Nanotechnology application to telecommunication and networking, Wiley Interscience.
7. John H. Davis: Physics of low dimension semiconductor, Cambridge Press.
8. Carl C. Cosh: Nanostructure materials processing property and applications, Noyes Publications.
2. K. K. Chattopadhyay and A. N. Banerjee: Introduction to Nanoscience and Nanotechnology, PHI Learning.
3. Vlaadiniz U. Mitin: Introduction to Nanoelectronics, Cambridge University Press.
4. M. Dragman and D. Dragman: Nanoelectronics- Principles and devices, Artech House.
5. Karl Goser: Nanoelectronics and Nanosystems, Springer.
6. Daniel Minoli: Nanotechnology application to telecommunication and networking, Wiley Interscience.
7. John H. Davis: Physics of low dimension semiconductor, Cambridge Press.
8. Carl C. Cosh: Nanostructure materials processing property and applications, Noyes Publications.
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